Force-detecting input structure

ABSTRACT

An input mechanism, such as a crown, detects amounts of applied force. In various examples, an assembly including an input mechanism has an enclosure; a stem coupled to the enclosure such that the stem is rotatable, translatable, and transversely moveable with respect to the enclosure; a sensor, coupled between the stem and the housing, to which force is transferred when the stem moves with respect to the housing; and a processing unit coupled to the sensor. The processing unit is operable to determine a measurement of the force, based on a signal from the sensor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation patent application of U.S. patentapplication Ser. No. 17/187,519, filed Feb. 26, 2021, and titled“Force-Detecting Input Structure,” which is a continuation patentapplication of U.S. patent application Ser. No. 16/738,198, filed Jan.9, 2020, and titled “Force-Detecting Input Structure,” now U.S. Pat. No.10,948,880, issued Mar. 16, 2021, which is a continuation patentapplication of U.S. patent application Ser. No. 16/391,856, filed Apr.23, 2019, and titled “Force-Detecting Input Structure,” now U.S. Pat.No. 10,572,053, issued Feb. 25, 2020, which is a continuation patentapplication of U.S. patent application Ser. No. 16/022,563, filed Jun.28, 2018, and titled “Force-Detecting Input Structure,” now U.S. Pat.No. 10,296,125, issued May 21, 2019, which is a continuation patentapplication of U.S. patent application Ser. No. 15/219,253, filed Jul.25, 2016, and titled “Force-Detecting Input Structure,” now U.S. Pat.No. 10,019,097, issued Jul. 10, 2018, the disclosures of which arehereby incorporated herein by reference in their entirety.

FIELD

The described embodiments relate generally to input mechanisms such ascrowns. More particularly, the present embodiments relate to an inputmechanism, such as a crown, that detects the amount of force applied.

BACKGROUND

Many devices, such as wearable electronic devices, use various inputmechanisms to receive user input. Many devices, particularly small formfactor devices, such as watches, smart watches, wearable devices, and soon, may have a limited number of input mechanisms

For example, many watches include a crown or similar input mechanisms.Some crowns can be rotated to wind the watch. Other crowns may betranslated into a time-changing position whereupon they may be rotatedto change the time of the watch.

SUMMARY

The present disclosure relates to an input mechanism, such as a crown,button, key, surface, or the like, that detects applied force. The inputmechanism may be included in an electronic device. A user may provideinput by rotating the input mechanism, translating the input mechanism,moving the input mechanism transversely, and so on. The input mechanismmay include one or more force sensors that the electronic device may useto determine a non-binary amount of the force applied to the inputmechanism. As the electronic device may determine non-binary amounts offorce corresponding to different types of movement, the input mechanismmay be used to receive a variety of different input.

In various embodiments, an electronic device includes a housing, acollar coupled to the housing, and an input structure extending from thecollar. The collar includes a moveable conductor, a conductive element,and a separation defined between the moveable conductor and theconductive element. Movement of the input structure changes acapacitance between the moveable conductor and the conductive element.

In some examples, the electronic device further includes a processingunit operative to determine an amount of force applied to the inputstructure based on the change in capacitance. In numerous examples, theelectronic device further includes silicone disposed within theseparation.

In various examples, the conductive element includes a flex circuit thatextends through at least part of the collar into the housing. In someexamples, the collar includes an inner core to which the conductiveelement is coupled and a compliant material disposed in the separationthat couples the conductive element and the moveable conductor. Innumerous examples, the input structure is operable to move withoutchanging the capacitance between the moveable conductor and theconductive element.

In some embodiments, an input mechanism assembly includes an enclosureand a stem coupled to the enclosure, such that the stem is rotatablewith respect to the enclosure, translatable toward and away from theenclosure, and transversely moveable with respect to the enclosure. Theinput mechanism assembly further includes a sensor, coupled between thestem and the enclosure, to which force is transferred when the stemmoves transversely with respect to the enclosure and a processing unit,coupled to the sensor, operable to determine a measurement of the force,based on a signal from the sensor. The processing unit may also beoperative to determine a direction in which the stem moves transversely.

In various examples, the sensor is a strain gauge. In other examples,the sensor includes a first conductor, a second conductor, and adielectric separating the first and second conductors. The dielectricmay be a compliant material.

In numerous examples, input mechanism assembly further includes a collarcoupled to the housing and the sensor couples the stem to the collar. Invarious examples, input mechanism assembly further includes a wirelesstransmission mechanism that wirelessly couples the processing unit andthe sensor. In some examples, input mechanism assembly further includesan additional sensor coupled between the stem and the processing unitand the processing unit is operable to determine a measurement of aforce that translates the stem, based on a signal from the additionalsensor.

In numerous embodiments, an electronic device, comprising: a body; acoupler positioned at least partially within the body; an inputmechanism, connected to the coupler, operable to move with respect tothe body; a capacitive sensor, coupled to the input mechanism, to whichforce is transferred when the input mechanism moves; and a processingunit operable to ascertain an amount of the force based on a change in acapacitance of the capacitive sensor.

In various examples, the coupler includes the capacitive sensor. In someexamples, the capacitive sensor includes a first capacitive element, asecond capacitive element, and a compliant material positioned betweenthe first and second capacitive elements. In some implementations ofsuch examples, the compliant material extends between the coupler andthe body and seals the coupler to the body.

In some examples, the input mechanism moves transverse with respect tothe body. In various examples, a portion of the input mechanism movescloser to the body. In numerous examples, a change in proximity betweenthe first and second conductors is proportional to the amount of theforce.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements.

FIG. 1 depicts an example electronic device including a force-detectinginput structure.

FIG. 2A depicts a schematic cross-sectional view of the electronicdevice of FIG. 1, taken along A-A of FIG. 1, illustrating a firstexample of the force-detecting input structure.

FIG. 2B depicts the electronic device of FIG. 2A while a user isexerting force to move the input structure transversely with respect toa housing of the electronic device.

FIG. 2C depicts the electronic device of FIG. 2A while a user isexerting force to translate the input structure towards the housing ofthe electronic device.

FIG. 3 depicts a second example of a force-detecting input structure inaccordance with further embodiments.

FIG. 4 depicts a third example of a force-detecting input structure inaccordance with further embodiments.

FIG. 5 depicts a fourth example of a force-detecting input structure inaccordance with further embodiments.

FIG. 6 depicts a fifth example of a force-detecting input structure inaccordance with further embodiments.

FIG. 7 depicts a sixth example of a force-detecting input structure inaccordance with further embodiments.

FIG. 8 depicts a seventh example of a force-detecting input structure inaccordance with further embodiments.

FIG. 9 depicts an eighth example of a force-detecting input structure inaccordance with further embodiments.

FIG. 10 depicts a flow chart illustrating an example method fordetecting force applied to a crown. This method may be performed by theelectronic devices of FIGS. 1-6.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

The description that follows includes sample systems, methods, andapparatuses that embody various elements of the present disclosure.However, it should be understood that the described disclosure may bepracticed in a variety of forms in addition to those described herein.

The following disclosure relates to a crown or other input mechanism orstructure, such as a button, key, switch, surface, or the like, that maybe included in an electronic device. The input structure may rotate,translate, move transversely, and so on. The input structure may includeone or more force sensors positioned in the input structure that may beused to determine an amount of applied force applied. As the electronicdevice may determine applied force corresponding to different types ofmovement, the input structure may be used to receive a variety ofdifferent inputs.

These and other embodiments are discussed below with reference to FIGS.1-10. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 depicts an example electronic device 100, including aforce-detecting input structure 101. The electronic device 100 may beoperable to receive input from a user. The electronic device 100 mayalso be operable to perform various actions in response to inputreceived via the force-detecting input structure 101. The electronicdevice 100 may receive different inputs based on rotation of theforce-detecting input structure 101, translation of the force-detectinginput structure 101, transverse movement of the force-detecting inputstructure 101, application of force to the force-detecting inputstructure 101, and so on.

When force is exerted on the force-detecting input structure 101, theelectronic device 100 may ascertain or measure the force. Generally, theelectronic device 100 may interpret different amounts of force asdifferent inputs.

FIG. 2A depicts a schematic cross-sectional view of the electronicdevice 100 of FIG. 1, taken along A-A of FIG. 1, illustrating a firstexample of a force-detecting input structure 101. As shown, the inputstructure 101 is a crown in this example. The input structure 101includes a stem 203 that is coupled to a housing 204, body, or otherenclosure of the electronic device 100. The input structure 101 iscoupled to the housing 204 via a collar 208 or other coupler, bushing207, and one or more gaskets 209.

With reference to FIGS. 2A-2C, the input mechanism assembly involvingthe input structure 101 will now be described in more detail. The collar208 may be positioned an aperture defined by the housing 204 (e.g., afirst aperture). A gasket 211 may be compressed between the collar 208and the housing 204, coupling the collar 208 to the housing 204. Thegasket 211 may form a seal or other barrier against passage ofcontaminants. The seal may be a liquid seal. The collar 208 may definean aperture (e.g., a second aperture). A portion of the stem 203 ispositioned in the aperture defined by the collar 208.

The collar 208 includes an inner core 225. Flex circuits 214 a, 214 b orother conductors are coupled to the inner core 225. The collar 208 alsoincludes compliant silicone 213 a, 213 b or other compliant dielectricmaterial coupled to the flex circuits 214 a, 214 b. The compliantsilicone 213 a, 213 b may be a portion of the gasket 211 that extends atleast partially through the collar 208. The collar 208 further includesmoveable conductors 212 a, 212 b coupled to the compliant silicone 213a, 213 b.

The stem 203 is slideably coupled at least partially around the collar208 by one or more bushings 207. The portion of the stem 203 extendingfrom the collar 208 is further slideably coupled at least partiallywithin the collar 208 by one or more gaskets 209 (such as one or moreo-rings). These slideable couplings allows the stem 203 to rotate withrespect to the housing 204 and the collar 208.

In some embodiments, the bushing 207 and/or the gasket 209 may be formedfrom compliant materials such as high molecular weight polyethylene,elastomer, and so on. In various embodiments, the stem 203 and/or thecollar 208 may be formed of polished or coated titanium or othersuitable materials that further permit the stem 203 to slide within andaround the collar 208. The bushing 207 and the gasket 209 may bear themajority of the stress relating to sliding of the stem 203.

A cap 202, knob, or similar structure may be coupled to the stem 203. Insome implementations, the stem 203 may snap to fit into the cap 202. Invarious implementations, the stem 203 may be bonded or otherwiseattached to the cap 202, such as by an adhesive.

Force detection using the input structure 101 will now be described. Thecollar 208 includes a number of capacitive sensors formed by the flexcircuits 214 a, 214 b, compliant silicone 213 a, 213 b, and the moveableconductors 212 a, 212 b. A capacitance of these respective capacitivesensors may be dependent on the proximity of the respective capacitiveelements (e.g., the moveable conductors 212 a, 212 b and the flexcircuits 214 a, 214 b) across separations defined between the respectivecapacitive elements. Compliant silicone 213 a, 213 b is positionedwithin the separations. The compliant silicone 213 a, 213 b deformsunder the application of force to allow the moveable conductors 212 a,212 b to move closer to and further away from the flex circuits 214 a,214 b, altering the capacitance between these respective capacitiveelements.

The movement of the moveable conductors 212 a, 212 b with respect to theflex circuits 214 a, 214 b may be proportional to the force exerted.Similarly, the changes in capacitance of the capacitive sensors may beproportional to the movement of the moveable conductors 212 a, 212 bwith respect to the flex circuits 214 a, 214 b. Thus, the changes incapacitance between the capacitive elements may be proportional to theforce exerted.

A processing unit 223 is electrically coupled to the flex circuits 214a, 214 b or other conductive elements. The processing unit 223 receivessignals that indicate changes in capacitance between the respectivecapacitive elements. The processing unit 223 correlates these changes incapacitance to amounts of force to determine the force applied to theinput structure 101. For example, the processing unit 223 may utilize alookup table or other data structure stored in a non-transitory storagemedium correlating capacitances and force amounts. The processing unit223 may be able to determine non-binary amounts forces that are applied.

Transverse movement of the input structure 101 (e.g., movement in one ofthe directions 262 shown in FIG. 2B) will now be described. Forceapplied to the input structure 101 is transferred by the stem 203 to therespective moveable conductors 212 a, 212 b, and therefore to thecompliant silicone 213 a, 213 b. This transferred force deforms thecompliant silicone 213 a, 213 b, thereby changing the proximity betweenthe moveable conductors 212 a, 212 b and the flex circuits 214 a, 214 b.These changes in proximity may alter capacitance between the moveableconductors 212 a, 212 b and the flex circuits 214 a, 214 b.

FIG. 2B depicts the electronic device 100 of FIG. 2A while a user 230 isexerting force to transversely move the input structure 101 in one ofthe directions 261 shown in FIG. 2B. The stem 203 receives and transfersthe exerted force to the collar 208. This transferred force deforms thecompliant silicone 213 a, 213 b. This shifts the moveable conductor 212a closer to the flex circuit 214 a. This also shifts the moveableconductor 212 b further from the flex circuit 214 b. The change inproximity between the moveable conductors 212 a, 212 b and the flexcircuits 214 a, 214 b changes the capacitance of the respectivecapacitive sensors formed thereby. The processing unit 223 analyzesthese changes in capacitance to determine the amount of the forceexerted on the input structure 101.

Additionally, the processing unit 223 may analyze changes in capacitanceto determine other information. For example, the processing unit 223 mayanalyze changes in capacitance to determine a direction in which theforce is applied, additional forces applied to the input structure 101,a direction of the transverse movement of the input structure 101, andso on. For example, force applied in the direction shown in FIG. 2B mayresult in an increase in the capacitance of the capacitive sensor (e.g.,force sensor) formed by the moveable conductor 212 a and the flexcircuit 214 a and a decrease in capacitance of the capacitive sensorformed by the moveable conductor 212 b and the flex circuit 214 b. Theprocessing unit 223 may compare the changes in capacitance to determinethat the force is applied in the direction shown in FIG. 2B.

Translational movement (e.g., movement in one of the directions 262shown in FIG. 2C) of the input structure 101 will now be described. Theslideable coupling of the stem 203 with respect to the collar 208 by thebushing 207 and the gasket 209 also allows the stem 203 to move towardthe housing 204 and the collar 208 and/or away from the housing 204 andthe collar in one of the directions 262 shown in FIG. 2C. Thus, the stem203 is translatable. Similarly to rotational movement, the bushing 207and the gasket 209 may bear the majority of the stress related to thesliding of the stem 203.

FIG. 2C depicts the electronic device 100 of FIG. 2A while a user 230 isexerting force to move the input structure 101 towards the housing 204.Translation of the input structure 101 towards the housing 204 decreasesgaps between the cap 202 and the housing 204 and/or the collar 208.

Although the moveable conductors 212 a, 212 b are illustrated anddescribed as separate components with respect to FIGS. 2A-2C, it isunderstood that this is an example. In various implementations, themoveable conductors 212 a, 212 b may be a single, unitary component. Forexample, in some implementations, the moveable conductors 212 a, 212 bmay be a ring positioned around the compliant silicone 213 a, 213 b.

In various implementations, the electronic device 100 may includeadditional components that interact with movement of the input structure101. In some embodiments, the electronic device 100 may include one ormore components that resist translation of the input structure 101towards the housing 204 and/or reverse such translation after force isexerted. For example, in some implementations, the electronic device 100may include a dome switch or similar actuator mechanism connected invarious ways to the stem 203. Translation of the stem 203 may compressthe dome switch. Thus, the dome switch may resist translation of thestem 203. However, sufficient force translating the stem 203 mayovercome the resistance and compress the dome switch. After exertion ofthe force, the dome switch may uncompress. This may reverse thetranslation of the stem 203.

In various embodiments, compression of the dome switch may also providea tactile output in response to translation of the stem 203. In variousimplementations, the processing unit 223 may receive one or more signalsrelated to compression or activation of the dome switch. By way ofexample, see the fourth example of a force-detecting input structure ofFIG. 5.

In numerous embodiments, the electronic device 100 may include variousmechanisms for detecting rotation, translation, or other movement of thestem 203. For example, in various implementations, one or moredetectable elements may be positioned on the stem 203 and/or othercomponents coupled to the stem 203. The detectable element may be anymechanism that is detectable by a detector. The detector may detect thedetectable element to track translational, rotational, and/or transversemovement of the stem 203. In some implementations, the detector may bean optical detector, and the detectable element may be a series of codedmarkings that the optical detector detects to determine position and/ormovement of the stem 203 with respect to the detector.

The electronic device 100 may include various additional components. Forexample, a cover glass 224 and/or display, touch display, and so on maybe coupled to the housing 204. Various configurations are possible andcontemplated without departing from the scope of the present disclosure.

Although FIGS. 2A-2C illustrate the input structure 101 as havingcapacitive sensors disposed in the collar 208 that may be used to detectthe amount of force applied to transversely move the input structure101, it is understood that this is an example. Various configurations ofthe input structure 101 are possible and contemplated without departingfrom the scope of the present disclosure.

For example, FIG. 3 depicts a second example of a force-detecting inputstructure 301 in accordance with further embodiments. Similar to theinput structure 101 of FIGS. 2A-2C, the force-detecting input structure301 includes a stem 303 slideably coupled to the housing 304, body, orother enclosure via the collar 308 or other coupler. However, in thisexample, the collar 308 may not include capacitive sensors. Instead, thebushings 307 a, 307 b may include capacitive sensors that may be used todetect force applied to the force-detecting input structure 301. Thecapacitive sensors may respectively include first conductors 341 a, 341b and second conductors 343 a, 343 b separated by compliant material 342a, 342 b. The compliant material 342 a, 342 b allows movement of thefirst conductors 341 a, 341 b and second conductors 343 a, 343 b inresponse to transverse movement of the stem 303. The flex circuits 314a, 314 b extend through the collar 308 to the bushings 307 a, 307 b toconnect the respective capacitive sensors to the processing unit 323.

In this example, the first conductors 341 a, 341 b and second conductors343 a, 343 b may be formed of materials that are conductive but stillallow sliding of the stem 303 with respect to the collar 308. Forexample, compliant capacitive materials such as metal-doped polymers maybe used. In other implementations, conductive materials that do notallow sliding may be embedded in material that does allow sliding.

In other implementations, the bushings 307 a, 307 b may not include suchconductive materials but may be compliant to allow movement of the stem303 and the collar 308. In such other implementations, portions of thestem 303 and the collar 308 may be the first and second conductors thatform the respective capacitive sensors. For example, the entire bushings307 a, 307 b may be formed of such a compliant material, the bushings307 a, 307 b may include compliant material within the bushings 307 a,307 b that allow the movement, and so on.

Although the bushings 307 a, 307 b are illustrated as includingcomponents forming capacitive sensors in the example shown in FIG. 3, itis understood that this is an example. In other implementations,capacitive sensors may be formed by elements in other components, suchas the gasket 309 without departing from the scope of the presentdisclosure. Further, although the input structures 101 and 301 of FIGS.2A-2C and 3 illustrate capacitive sensors that are used to detectamounts of force that move the input structures 101 and 301transversely, it is understood that these are examples. Input structuresin other implementations may be configured to detect amounts of forceexerted in other directions without departing from the scope of thepresent disclosure.

For example, FIG. 4 depicts a third example of a force-detecting inputstructure 401 in accordance with further embodiments where amounts offorce that translate the input structure 401 toward and/or away from thehousing 404 may be detected. Similar to the input structure 101 of FIGS.2A-2C, the input structure 401 includes compliant material 444 a, 444 b,moveable portions 412 a, and flex circuits 414 a, 414 b or otherconductive materials. However, in this example, the moveable portions412 a, 412 b are moveable by translation of the input structure 401.Thus, capacitive sensors formed by the moveable portions 412 a, 412 b,the flex circuits 414 a, 414 b, and the compliant material 444 a, 444 bmay be used to detect amounts of force that translate the inputstructure 401.

In still other examples, capacitive sensors may be formed by othercomponents of the input structure 401 and/or electronic devices thatinclude such input structures 401. FIG. 5 depicts a fourth example of aforce-detecting input structure 501 in accordance with furtherembodiments where a shear plate 521 positioned between the stem 503 anda dome switch 522 or other actuator includes such a capacitive sensor.

In this embodiment, a structure 517 couples the collar 508 to thehousing 504. The dome switch 522 is mounted to the structure 517 so thattranslation of the stem 503 may compress the dome switch 522. The shearplate 521 separates the dome switch 522 from the stem 503. Flex circuit518 and/or other electrical connections connect the dome switch 522 andthe processing unit 523.

In this example, the shear plate 521 includes a capacitive sensor formedby a first conductor 545 separated from a second conductor 547 by acompliant material 546. The capacitive sensor may be used to detectamounts of force that translate the input structure 501.

Contrasted with the input structure 101 of FIGS. 2A-2C, thisimplementation may allow detection of force using the input structure501 while allowing use of a unitary collar 508. This implementation mayalso allow detection of force using the input structure 501 withoutextending the flex circuit 514 through the collar 508, gasket 511, andso on.

Although the examples illustrated in FIGS. 2A-5 directly connect theprocessing units 223-523 to the respective capacitive sensors, it isunderstood that these are examples. Other configurations are possibleand contemplated without departing from the scope of the presentdisclosure. For example, in various implementations, wirelessconnections and/or wireless transmission mechanisms may be used thatallow unitary collars 208-508 and/or do not extend electricalconnections through gaskets 211-511 and/or other components.

For example, FIG. 6 depicts a fifth example of a force-detecting inputstructure 601 in accordance with further embodiments that uses inductivecoils 649, 650 as a wireless transmission mechanism to electricallyconnect capacitive sensors with processing unit 623 (via a flex circuit648 and/or other electrical connection). In this example, inductivecoils 649, 650 inductively exchange power such that the processing unit623 receives changes in capacitance of capacitive sensors formed bymoveable portions 612 a, 612 b, compliant material 613 a, 613 b, flexcircuits 614 a, 614 b and/or other electrical connection. In this way,the processing unit 623 may determine applied force without extendingthe flex circuit 648 through the gasket 611.

Although the examples illustrated in FIGS. 2A-6 detect force applied tothe various input structures 101-601 using the various respectivecapacitive sensors, it is understood that these are examples. In variousimplementations, force detection sensors other than and/or in additionto capacitive sensors may be used without departing from the scope ofthe present disclosure. For example, in various implementations,piezoelectric material that generates a voltage when deformed may beused. In such examples, the voltage may be proportional to the amount ofdeformation, and thus the force exerted. As such, the voltage generatedby the piezoelectric material may be correlated to force amounts todetermine the force exerted.

By way of another example, strain gauges may be used as force detectionsensors in various implementations instead of and/or in addition tocapacitive sensors. FIG. 7 depicts a sixth example of a force-detectinginput structure 701 in accordance with further embodiments that utilizestrain gauges 751 a, 751 b to determine force exerted on the inputstructure 701.

In this example, the collar 708 may be formed from materials that can bestrained by force transferred by the stem 703. Strain gauges 751 a, 751b are disposed on the collar 708 in areas of the collar 708 that arestrained by the transferred force. The processing unit 723 receivessignals indicating the strain via flex circuits 714 a, 714 b and/orelectrical connections and may correlate the strain to force amounts todetermine force applied to the input structure 701.

Although FIG. 7 illustrates a particular configuration of strain gauges751 a, 751 b, it is understood that this is an example. In variousimplementations, various components may be strained by force applied tothe input structure 701 and strain gauges 751 a, 751 b may be disposedon and/or in such components.

By way of example, FIG. 8 depicts a seventh example of a force-detectinginput structure 801 in accordance with further embodiments. In thisexample, a shaft of the stem 803 may be formed from a material that isstrained by force exerted on the stem 803 and strain gauges 852 a, 852 bmay be disposed on the shaft. The processing unit 823 may wirelesslyreceive strain data from the strain gauges 852 a, 852 b via inductivecoils 853, 854 (to which the processing unit 823 may be coupled via theflex circuit 814 and/or other electrical connections). The processingunit 823 may correlate the strain to force amounts to determine forceapplied to the input structure 801.

By way of another example, FIG. 9 depicts an eighth example of aforce-detecting input structure 901 in accordance with furtherembodiments. In this example, arms 955 a, 955 b of the stem 903 may beformed from a material that is strained by force exerted on the stem 903and strain gauges 952 a, 952 b may be disposed on the arms 955 a, 955 b.The processing unit 923 may wirelessly receive strain data via inductivecoils 953, 954 and the flex circuit 914 and/or other electricalconnection and correlate the strain to force amounts.

Although FIGS. 2A-9 illustrate and describe various force sensors thatare variously configured and positioned to detect the amount of forcesapplied to the respective input structures 101-901 in variousdirections, it is understood that these are examples. In variousimplementations, any kind of force sensors may be located in a varietyof different areas to detect the amount of a variety of different forcesthat may be exerted on the input structures 101-901 without departingfrom the scope of the present disclosure.

Further, although the input structures 101-901 are illustrated as crownswith respect to FIGS. 2A-9, it is understood that these are examples. Invarious implementations, the techniques discussed herein may be utilizedwith a variety of different input mechanisms and/or input mechanismassemblies without departing from the scope of the present disclosure.Such input mechanisms may be operable to receive translational input,rotational input, input related to transverse movement, and/or a varietyof different movement related input.

Additionally, although the electronic devices 100 of FIGS. 1-9 areillustrated as a smart watch, it is understood that these are examples.In various implementations, the techniques illustrated and describedherein may be utilized with a variety of different devices withoutdeparting from the scope of the present disclosure. Such devices mayinclude wearable electronic devices, laptop computing devices, cellulartelephones, displays, tablet computing devices, mobile computingdevices, smart phones, digital media players, desktop computing devices,printers, speakers, input devices, and so on.

FIG. 10 depicts a flow chart illustrating an example method 1000 fordetecting force applied to a crown or other input structure. This method1000 may be performed by the electronic devices 100 of FIGS. 1-6.

At 1010, an electronic device operates. The flow proceeds to 1020 wherethe electronic device monitors the capacitance of one or more capacitivesensors associated with force exerted on an input mechanism such as acrown. Next, the flow proceeds to 1030 where the electronic devicedetermines whether or not the capacitance has changed.

If the capacitance has not changed, the flow returns to 1010 where theelectronic device continues to operate. Otherwise, the flow proceeds to1040.

At 1040, after the electronic device determines that the capacitance ofone or more capacitive sensors associated with force exerted on an inputmechanism such as a crown has changed, the electronic device correlatesthe capacitance change to an amount of force. The flow then proceeds to1050 where the electronic device performs one or more actionscorresponding to the force amount.

For example, the electronic device may interpret the force amount asinput indicating to select an icon displayed on a display and/or toexecute an application associated with such an icon. In some examples,the electronic device may interpret the force amount as input indicatingto select the icon displayed on the display if the force amount exceedsa first force threshold and to execute the application associated withthe icon if the force amount exceeds a second, greater threshold. Inthis way, application of force may be used by a user to signal actionstypically triggered by a single mouse click and a double mouse click ofthe icon without utilization of a mouse as an input device.

From 1050, after the electronic device performs the one or more actionscorresponding to the amount of force, the flow returns to 1010. At 1010,the electronic device continues to operate.

Although the example method 1000 is illustrated and described asincluding particular operations performed in a particular order, it isunderstood that this is an example. In various implementations, variousorders of the same, similar, and/or different operations may beperformed without departing from the scope of the present disclosure.

For example, the example method 1000 is illustrated and described asmonitoring changes in the capacitance of a capacitive sensor anddetermining force amounts based on such changes. However, in variousimplementations, force sensors other than capacitive sensors may be usedwithout departing from the scope of the present disclosure. Use of suchother force sensors may include monitoring voltages generated bydeformation of piezoelectric material, receiving signals from one ormore strain gauges, and so on.

As described above and illustrated in the accompanying figures, thepresent disclosure relates to a crown or other input mechanism includedin an electronic device, such as a button, key, switch, surface, or thelike. The crown may rotate, translate, move transversely, and so on. Thecrown may include one or more force sensors positioned in the inputmechanism that may be used to determine an amount of force applied tothe crown. In this way, the crown may be used to receive a variety ofdifferent inputs from the user.

In the present disclosure, the methods disclosed may be implemented assets of instructions or software readable by a device. Further, it isunderstood that the specific order or hierarchy of steps in the methodsdisclosed are examples of sample approaches. In other embodiments, thespecific order or hierarchy of steps in the method can be rearrangedwhile remaining within the disclosed subject matter. The accompanyingmethod claims present elements of the various steps in a sample order,and are not necessarily meant to be limited to the specific order orhierarchy presented.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device, comprising: a housing; acollar, coupled to the housing, comprising: a moveable conductor; aconductive element; and a separation defined between the moveableconductor and the conductive element; and an input structure extendingfrom the collar; wherein movement of the input structure changes acapacitance between the moveable conductor and the conductive element.2. The electronic device of claim 1, further comprising a processingunit operative to determine an amount of force applied to the inputstructure based on the change in capacitance.
 3. The electronic deviceof claim 1, further comprising silicone disposed within the separation.4. The electronic device of claim 1, wherein the conductive elementcomprises a flex circuit that extends through at least part of thecollar into the housing.
 5. The electronic device of claim 1, whereinthe collar comprises: an inner core to which the conductive element iscoupled; and a compliant material disposed in the separation thatcouples the conductive element and the moveable conductor.
 6. Theelectronic device of claim 1, wherein the input structure is operable tomove without changing the capacitance between the moveable conductor andthe conductive element.
 7. An input mechanism assembly, comprising: anenclosure; a stem coupled to the enclosure, such that the stem is:rotatable with respect to the enclosure; translatable toward and awayfrom the enclosure; and transversely moveable with respect to theenclosure; a sensor, coupled between the stem and the enclosure, towhich force is transferred when the stem moves transversely with respectto the enclosure; and a processing unit, coupled to the sensor, operableto determine a measurement of the force, based on a signal from thesensor.
 8. The input mechanism assembly of claim 7, wherein theprocessing unit is operative to determine a direction in which the stemmoves transversely.
 9. The input mechanism assembly of claim 7, whereinthe sensor comprises a strain gauge.
 10. The input mechanism assembly ofclaim 7, wherein the sensor comprises: a first conductor; a secondconductor; and a dielectric separating the first and second conductors.11. The input mechanism assembly of claim 10, wherein the dielectriccomprises a compliant material.
 12. The input mechanism assembly ofclaim 7, further comprising: a collar coupled to the enclosure; whereinthe sensor couples the stem to the collar.
 13. The input mechanismassembly of claim 7, further comprising a wireless transmissionmechanism that wirelessly couples the processing unit and the sensor.14. The input mechanism assembly of claim 7, further comprising: anadditional sensor coupled between the stem and the processing unit;wherein the processing unit is operable to determine a measurement of aforce that translates the stem, based on a signal from the additionalsensor.
 15. An electronic device, comprising: a body; a couplerpositioned at least partially within the body; an input mechanism,connected to the coupler, operable to move with respect to the body; acapacitive sensor, coupled to the input mechanism, to which force istransferred when the input mechanism moves; and a processing unitoperable to ascertain an amount of the force based on a change in acapacitance of the capacitive sensor.
 16. The electronic device of claim15, wherein the coupler includes the capacitive sensor.
 17. Theelectronic device of claim 15, wherein the capacitive sensor comprises:a first capacitive element; a second capacitive element; and a compliantmaterial positioned between the first and second capacitive elements;wherein the compliant material: extends between the coupler and thebody; and seals the coupler to the body.
 18. The electronic device ofclaim 17, wherein a change in proximity between the first and secondcapacitive elements is proportional to the amount of the force.
 19. Theelectronic device of claim 15, wherein the input mechanism movestransverse with respect to the body.
 20. The electronic device of claim15, wherein a portion of the input mechanism moves closer to the body.